It takes hard work to create a hardened outside plant modem.
Long-term industry experts, Alpha has shipped over 1 million hardened DOCSIS units.
Doing this hard work up front is what separates Alpha from the competition.

Environmental Considerations
Our design considers the external environment, as well as the internal environment of the device.
- Temperature differential can reach 10+℃ between the outside environment and the internal components
- Components are tested against tougher conditions due to this temperature difference
- Tested against multiple environmental factors besides temperature, such as humidity, electromagnetic interference, and radiation

Internal Components
Each component on the board is carefully selected and placed to minimize failure at any opportunity.
- The onboard components minimize RF impact while maximizing potential heat transfer
- The components have a high Mean Time Between Failures (MTBF), as servicing parts can be difficult
- No moving or serviceable parts, as these increase failure rates in tough conditions

Remote Nature of the Installation
The remote nature of the outside plant means our devices are not easily accessible, and they must look out for themselves.
- There are no individual parts that can fail (fans and batteries always fail in tough environments)
- A reboot takes a truck roll. Servicing modems that regularly fail require too much manpower. Our units "self-heal" in the system using built-in processes
- We do more than just route traffic. Advanced remote access diagnostic tools simplify and automate servicing

Testing and Verification
Our modems have over 2500 hours of testing, including verification and conformance with multiple regulatory bodies and code:
- DOCSIS compliance
- EMI / RFI compliance
- High voltage survivability compliance
- Industrial temperature testing
- Severe environment testing
- Thermal shock testing
- Vibration survivability testing
- Remote operation and recovery testing
Our Modem History

2000's
2002 - ANSI-SCTE, Outside Plant (OSP) Equipment Monitoring using DOCSIS
2003 - DOCSIS Design Center, Bellingham, WA
2004 - Industries First DOCSIS 1.0 OSP Power Supply Transponder
2006 - DOCSIS 1.1 Power Supply Transponder
2008 - Added Design Support, Trivandrum, India
2003 - DOCSIS Design Center, Bellingham, WA
2004 - Industries First DOCSIS 1.0 OSP Power Supply Transponder
2006 - DOCSIS 1.1 Power Supply Transponder
2008 - Added Design Support, Trivandrum, India

2010's
2010 - DOCSIS 2.0 Power Supply Transponder
2015 - DOCSIS 3.0 Power Supply Transponder & Gateway Modem
2015 - Gateway Product Field Trials
2015 - Added Design Center, Pittsburgh, PA
2017 - DOCSIS 3.1 Product in Development
2017 - Added Design Center, Indianapolis, IN
2015 - DOCSIS 3.0 Power Supply Transponder & Gateway Modem
2015 - Gateway Product Field Trials
2015 - Added Design Center, Pittsburgh, PA
2017 - DOCSIS 3.1 Product in Development
2017 - Added Design Center, Indianapolis, IN